NVIDIA Jetson AGX Orin 32 GB (Available from August 2022)

M.R.P.:
₹91,948.00
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GPU: NVIDIA Ampere architecture with 1792 NVIDIA® CUDA® cores and 56 Tensor Cores
CPU: 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3
DL Accelerator: 2x NVDLA v2.0
Vision Accelerator: PVA v2.0
Memory: 32GB 256-bit LPDDR5 204.8 GB/s
Storage: 64GB eMMC 5.1
Power: 15W - 40W
Networking: 1x GbE, 1x 10GbE
Display: 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1
Max GPU Freq: 939 MHz
CPU Max Freq: 2.2 GHz
DLA Max Frequency: 1.4 GHz
CSI Camera: Up to 6 cameras (16 via virtual channels*) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)
Video Encode: 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) H.264, AV1
Video Decode: 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) H.264, VP9, AV1
UPHY: Up to 2 x8, 1 x4, 2 x1 (PCIe Gen4, Root Port & Endpoint), 3x USB 3.2
Other I/O: 4x USB 2.0, 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs
Mechanical: 100mm x 87mm, 699-pin Molex Mirror Mezz Connector, Integrated Thermal Transfer Plate
Product Dimensions: 110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution)
GPU: NVIDIA Ampere architecture with 1792 NVIDIA® CUDA® cores and 56 Tensor Cores
CPU: 8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3
DL Accelerator: 2x NVDLA v2.0
Vision Accelerator: PVA v2.0
Memory: 32GB 256-bit LPDDR5 204.8 GB/s
Storage: 64GB eMMC 5.1
Power: 15W - 40W
Networking: 1x GbE, 1x 10GbE
Display: 1x 8K60 multi-mode DP 1.4a (+MST)/eDP 1.4a/HDMI 2.1
Max GPU Freq: 939 MHz
CPU Max Freq: 2.2 GHz
DLA Max Frequency: 1.4 GHz
CSI Camera: Up to 6 cameras (16 via virtual channels*) 16 lanes MIPI CSI-2 D-PHY 2.1 (up to 40Gbps) | C-PHY 2.0 (up to 164Gbps)
Video Encode: 1x 4K60 | 3x 4K30 | 6x 1080p60 | 12x 1080p30 (H.265) H.264, AV1
Video Decode: 1x 8K30 | 2x 4K60 | 4x 4K30 | 9x 1080p60| 18x 1080p30 (H.265) H.264, VP9, AV1
UPHY: Up to 2 x8, 1 x4, 2 x1 (PCIe Gen4, Root Port & Endpoint), 3x USB 3.2
Other I/O: 4x USB 2.0, 4x UART, 3x SPI, 4x I2S, 8x I2C, 2x CAN, DMIC & DSPK, GPIOs
Mechanical: 100mm x 87mm, 699-pin Molex Mirror Mezz Connector, Integrated Thermal Transfer Plate
Product Dimensions: 110mm x 110mm x 71.65mm (Height includes feet, carrier board, module, and thermal solution)